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VEMD2000X01, VEMD2020X01
www.vishay.com
REFLOW SOLDER PROFILE
Vishay Semiconductors
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
300
250
200
255 °C
240 °C
217 °C
max. 26 0 °C
245 °C
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
150
max. 30 s
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
100
max. 120 s
max. 100 s
Conditions: T amb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
50
0
max. ramp up 3 °C/s max. ramp down 6 °C/s
DRYING
In case of moisture absorption devices should be baked
0
50
100
150
200
250
300
before soldering. Conditions see J-STD-020 or label.
19841
Time (s)
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
PACKAGE DIMENSIONS in millimeters: VEMD2000
0.4
2.2
Z
? 1.8 ± 0.1
2.2
5.8 ± 0.2
Z 20:1
1.1 ± 0.1
2.3 ± 0.2
expo s ed copper
Cathode
Pin ID
Anode
technical drawing s
1.7
S older pad propo s al
according to DIN
s pecification s
acc. IPC 7351
Not indicated tolerance s ± 0.1
? 2.3 ± 0.1
6.7
Drawing-No.: 6.544-5391.02-4
I ss ue: 2; 18.03.10
21517
Rev. 1.3, 23-Aug-11
4
Document Number: 81962
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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